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1.
Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture 总被引：3，自引：0，他引：3
This study was conducted to optimize hot pressing time and adhesive content for the manufacture of three-layer medium density
fiberboard (MDF) through the cure acceleration of phenol-formaldehyde (PF) adhesives by adding three carbonates (propylene
carbonate, sodium carbonate, and potassium carbonate) in the core layer. Carbonate type, carbonate level, PF resin content,
and hot pressing time were evaluated on the basis of the performance of MDF panels prepared. The application of cure-accelerated
PF adhesives by the addition of propylene carbonate reduced both PF resin content and total hot pressing time by 38% and 29%,
respectively, for the manufacture of quality three-layer MDF panels (19.1 mm thickness) under the hot-pressing temperature
of 205 °C. The optimum concentration of propylene carbonate for cure acceleration of PF resin was found to be 3 wt% by weight
based on the resin solids. Bending properties, on one hand, were independent of carbonate type and level, and complied with
the minimum requirements by ANSI. Internal bond (IB) strength, on the other hand, was closely related with carbonate types
and level used.
Received 13 March 1999 相似文献
2.
Larix tannin-phenol-formaldehyde (TPF) adhesive, having 60% by weight of phenol being replaced, was evaluated for its utilization
in plywood. The kinetic characteristic of the TPF resin was investigated through differential scanning calorimetry (DSC) and
the results obtained from the DSC scans show that the resin has a little bit different thermochemical behavior from that of
phenol-formaldehyde (PF) resin. Two kinds of plywood panels were produced using the TPF adhesive in laboratory. The desired
test results met the Chinese GB 9846-88 and ZB B70006-88, respectively, and the long assembly time of TPF resin in preparing
plywood can be improved by mixing with the filler.All the properties of plywoods bonded with the TPF adhesive were compared
with those obtained with synthetic PF adhesive. 相似文献
3.
INTRoDUCTIoNTheuseoftannin-basedadhesivesforthemanufactureofplywoodhasbeenre-portedbypreviousauthors(DaItonl95o,Herzbergl96o,Kulvikl975,Suomi-Lindbergl984,Vazquezl992,etc).Asthepotentialrawmaterialinpreparingadhe-sivecomponCnts,tannincanbeextractedfrommanyplantspecies-Suchprepara-honsarebasedonthereactionofbarkphenoliccomponentswithanaldehyde,usuaIlyformaldehyde.Thesevegetabletanninswhosecomponentsarephenoliccomponentsprovideapossibilityofusingthemforreplacingcertaincomponentsofsynthet… 相似文献
4.
以脱脂大豆粉为原料制备大豆蛋白基胶黏剂(豆胶,S),以普通甲醛制备的酚醛树脂(PF_1)和高浓度甲醛制备的酚醛树脂(PF_2)为交联剂,使用前将两者直接混合得酚醛树脂改性豆胶(PF_1/S、PF_2/S)。利用差示扫描量热(DSC)、红外光谱(FT-IR)、动态热机械性能(DMA)和核磁共振碳谱(~(13) C NMR)分析对产品性能进行了测试与表征。结果表明:等物质的量之比条件下,高浓度甲醛较之普通甲醛制备的酚醛树脂改性豆胶胶合板干、湿剪切强度分别提高4.3%和11.6%,并且强度稳定性好;动态DSC分析表明,PF_2可以降低豆胶体系的固化温度和活化能,与豆胶的交联反应较容易;~(13) C NMR分析表明,PF_2体系羟甲基达88.73%,明显高于PF_1的80.91%;FT-IR分析证实酚醛树脂与豆胶中的氨基发生反应,并且PF_2反应效率更高;DMA分析表明,PF_2/S能够改善胶合产品的力学性能和热稳定性,降低豆胶的固化反应起始温度,提高固化反应速率。 相似文献
5.
6.
This study investigated the liquefaction of bamboo in phenol, which involved the effects of weight ratios of phenol to bamboo,
amount of catalyst, temperature, etc. The study showed that liquefaction could be accomplished with a phenol to bamboo weight
ratio of 2–1: 1, a 5% catalyst of HCl or BF3, and a temperature of 115°C. Liquefied bamboo formaldehyde (BLF) resin adhesive for exterior use could be obtained with a
phenol to formaldehyde molar ratio of 1:1.6–2.0. The curing behavior of BLF resin adhesive, studied by TG-DSC and IR analyses,
showed that BLF resin adhesives had a lower curing temperature than PF adhesives but had the same characteristic trough in
IR spectra as PF adhesives.
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Translated from Chemistry and Industry of Forest Products, 2004, 24(3) [译自: 林产化学与工业, 2004, 24(3)] 相似文献
7.
The search for new value-added uses for oilseed and animal proteins led us to develop protein-based wood adhesives. Low-fat
soy and peanut flours and blood meal were hydrolyzed in an alkaline state, and PF-cross-linked protein resins were formulated
by reacting the protein hydrolyzates with phenol-formaldehyde (PF) in solid-tosolid ratios ranging from 70% to 50% hydrolyzates
and 30% to 50% PF. Physical properties of medium density fiberboard (MDF) bonded with protein-based phenolic resins were compared
to those of boards bonded with ureaformaldehyde (UF) and PF resins, and flakeboard bonded with soy protein-based phenolic
resin was compared to PF-bonded board. As MDF binders, adhesive properties of protein-based phenolic resins depended upon
protein content of proteinacious materials. MDF board bonded with blood-based phenolic resin was comparable to PF-bonded board
and met the requirements for exterior MDF. Boards bonded with soy-protein-based phenolic resin met requirements for interior
MDF, while peanut-based phenolic failed to meet some of the requirements. Flakeboard bonded with soy-protein-based phenolic
resins was inferior to PF-bonded board but outperformed PF-bonded board in accelerated aging tests. Although they exhibit
a slow curing rate, the cost effectiveness and superior dimensional stability of protein-based phenolic resins may make them
attractive for some uses. 相似文献
8.
采用固化剂缩短酚醛胶刨花板热压时间的研究 总被引：5，自引：0，他引：5
采用添加固化剂的方法，对降低酚醛树脂胶刨花板的热压时间进行了研究。通过筛选试验，选出了加速酚醛胶固化效果比较好的固化剂Ｎ，同时探讨了固化剂Ｎ的用量与酚醛树脂胶聚合时间之间的关系，进而确定了固化剂Ｎ的合适用量。试验结果表明，当固化剂用量为２％时，１６ｍｍ厚的酚醛树脂胶刨花板的热压时间可以从１４ｍｉｎ缩短到１０ｍｉｎ，热压时间缩短了２８．５７％。 相似文献
9.
The technology of liquefying processed-waste bamboo with phenol is investigated by single factor trials and an orthogonal
design. We studied the preparation technology and properties of adhesives from this phenol-liquefied bamboo with formaldehyde
(BPF). The results show that temperature has a significant effect on liquefaction. The effect of the mass ratio of phenol
to bamboo comes second and the catalyst dosage within the range of 2%–4% is the least effective. The optimum conditions of
liquefaction are as follows: a mass ratio of phenol to bamboo 3.5, a catalyst dosage of 4%, liquefying temperature 145°C and
liquefying time 60 min. The liquefaction rate of bamboo reached 99.1%. For the preparation of the adhesive, a mass ratio of
liquefied bamboo products to formaldehyde (37%) is 100 to 164.8–199.5, while the ratio 100 to 108.2 is the best. This adhesive
has a lower curing temperature than that of normal PF resin. At a hot-press temperature of 130 or 140°C, this new adhesive
provides excellent bonding strength of plywood. The most favorable temperature for hot-pressing is 140°C.
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Translated from Chemistry and Industry of Forest Products, 2007, 27(6): 65–70 [译自: 林产化学与工业] 相似文献
10.
重组竹制造工艺的研究 总被引：13，自引：0，他引：13
本文是作者在施胶量、热压温度和热压时间三个主要因子对重组竹性能影响的初步研究基础上又进一步探讨了施胶方式、竹纤维束水洗、胶种以及胶的浓度等因素对产品性能的作用。研究结果表明:竹纤维束水洗有较显著的作用;水溶性酚醛胶比醇溶性酚醛胶更适用于重组竹的制造,胶液浓度过稀不仅自身性能差,而且还会使重组竹性能降低;采用浸胶方法虽有利于胶液的均勻分布,但对IB未产生明显的作用。 相似文献
11.
三聚氰胺改性低毒脲醛树脂耐水性研究 总被引：1，自引：0，他引：1
不同摩尔比的两类低毒脲醛树脂(JQ21未改性,JQ22与5%三聚氰胺共聚),分别与不同质量比的三聚氰胺树脂混合,并在不同的固化体系中固化,用于胶合板的压制.对胶合板的胶合性能及甲醛释放量进行了研究.实验结果表明:固化体系不同,胶接强度也不相同;随着摩尔比的增加,胶接强度提高,甲醛释放量亦相应提高;同时采用共聚和共混两种方法进行改性的脲醛树脂,其胶接强度和甲醛释放量均优于单一的采用共混改性的脲醛树脂;并且混合胶液中三聚氰胺的比例越低,胶接性能越筹,甲醛释放量变化逐渐趋于平稳. 相似文献
12.
浅谈木材用胶粘剂的发展 总被引：3，自引：0，他引：3
介绍了胶粘剂的概念、组成、种类以及人造板工业中用得最多的三种胶粘剂：脲醛树脂、酚醛树脂和三聚氰胺树脂，阐明了天然胶的复苏情况和生物技术利用在木材胶粘剂的现状，并对木材胶粘剂的发展趋势进行了展望。 相似文献
13.
韩建 《中南林业科技大学学报(自然科学版)》2007,27(3):101-105
以改性三聚氰胺甲醛树脂(MF树脂)和酚醛树脂(PF树脂)为胶粘剂,设计了两组热压工艺参数,按照“冷-热-冷”工艺压制竹帘胶合板.对制品按标准JG/165-2004进行了检测,并对检测结果进行比较分析.分析结果表明,该改性MF树脂竹帘胶合板的弹性模量稍高于PF树脂竹帘胶合板,但静曲强度和保留强度不如PF树脂竹帘胶合板.如果适当增加产品的密度和降低改性MF树脂中尿素的比例,产品质量将可以进一步提高,证明该改性MF树脂可以替代PF树脂用于竹帘胶合板生产,且产品质量可以达到标准JG/165-2004的要求. 相似文献
14.
The development of the shear strength of the phenol–formaldehyde (PF) adhesive bond during curing was investigated. Five different PF adhesive mixtures and 1.1 mm thick peeled beech (Fagus sylvatica L.) veneer were used to produce lap-shear specimens, which were cured at a pressing temperature of 160°C. Dielectric analysis (DEA) and modified ABES (automated bonding evaluation system) were used to evaluate the physical–chemical and mechanical aspects of PF adhesive cure in a miniature hot-press. The degree of cure, which was calculated from conductivity data, was dependent on pressing time and the composition of the PF adhesive. An addition of rye flour to the PF adhesive significantly postponed the curing process as determined by DEA. It was found that the adhesive bond started to develop in the last stage of the curing (vitrification), by which time most of the physical–chemical conversion of the adhesive had been completed. 相似文献
15.
Curing kinetics of phenol formaldehyde resin and wood-resin interactions in the presence of wood substrates 总被引：1，自引：0，他引：1
The curing kinetics of resol PF resin and resin–wood interactions in the presence of wood substrates have been studied by differential scanning calorimetry (DSC) and Fourier transform infrared (FTIR) spectroscopy. The activation energy of cure of PF resin generally increases when PF resin is mixed with wood, mainly due to the decrease of the pH values resulting from the presence of wood. However, wood decreases the curing enthalpy of PF resin through diffusion and the change in the phase of the curing system, which suggests that the curing reactions reached a lower final degree of conversion for the mixtures of PF resin with wood than for the PF resin alone. Moreover, DSC curves and the variation of activation energy with conversion indicate that wood accelerates the addition reactions and retards condensation ones during the curing process of PF resin with wood. The study also revealed that almost no chemical reactions occur between PF resin and wood, but the secondary force interactions of hydroxyl groups between PF resin and wood have been detected. These most significant secondary forces can catalyze the self-condensation reactions of PF resin, although their effect is not vital on the curing kinetics of PF resin. 相似文献
16.
17.
Dong-heub Lee Myung Jae Lee Dong-Won Son Byung-Dae Park 《Wood Science and Technology》2006,40(3):228-236
The extended use of woods treated with traditional or alternative preservatives for exterior applications requires an assessment
of wood adhesive performance. This study attempts to evaluate the performance of wood adhesives for woods treated with various
waterborne preservatives. Two softwood species, i.e. Korean pine (Pinus koraiensis Sieb. et Zucc.) and Japanese Larch (Larix leptolepis [Sieb. et Zucc.] Gordon) were treated with copper–chrome–arsenic (CCA), CB-HDO, or copper azole (CY), and then bonded with
four different wood adhesives such as urea–melamine–formaldehyde (UMF) resin, melamine–formaldehyde (MF) resin, phenol–formaldehyde
(PF) resin, and resorcinol–formaldehyde (RF) resin. The performance of these adhesives was evaluated by measuring the dry
shear strength of adhesive-bonded wood block on compression. Both UMF and MF resins produced a relatively strong adhesive
strength for CY-treated pine and larch woods. The PF resin also produced good bond strength when bonded with either larch
wood treated with CY or pinewood treated with CB-HDO. The best result was obtained when the CB-HDO-treated woods were bonded
with RF resin. For a better bond strength development, a proper combination of adhesive, preservative, and wood species should
be selected by taking into consideration of the characteristics of these three parameters as well as their interactions. 相似文献
18.
为获得无甲醛释放的环保胶合板,将热塑性树脂薄膜(低密度聚乙烯(LLDPE)、聚丙烯(PP)、聚氯乙烯(PVC))用作胶黏剂,并利用空气介质阻挡等离子体对热塑性树脂薄膜进行表面改性处理以提高薄膜与杨木单板的界面相容性,从而获得性能良好的环保胶合板。研究了等离子体处理对胶合板胶合性能的影响,并从等离子体处理对热塑性树脂薄膜表面化学组分及其对胶合板界面形貌的影响分析其胶合机理。结果表明:在等离子体处理功率为4.5 kW、处理时间为8 m/min的条件下处理热塑性树脂薄膜,胶合板的胶合强度得到显著提高,LLDPE/杨木胶合板的胶合强度从0.49 MPa增至0.81 MPa,PP/杨木胶合板的胶合强度从0.65 MPa提高到0.84 MPa,均达到Ⅱ类胶合板标准要求。其中用等离子体处理后PVC与杨木制备的胶合板能满足Ⅰ类胶合板的标准要求,胶合强度达到0.79 MPa。XPS分析表明,等离子体改性热塑性树脂薄膜的表面发生了氧化反应,引入了含氧官能团,提高了薄膜表面极性,有利于提高薄膜与杨木单板之间的相互作用,从而使得胶合板的界面胶合更为紧密,说明等离子体处理后树脂与杨木单板的相容性提高,树脂能在单板表面更好地附着。热塑性树脂薄膜与杨木单板制备的胶合板仅有极微量甲醛释放,其主要源于木材自身,远低于国家标准对人造板甲醛释放限量的要求。研究证明等离子体处理能明显改善热塑性树脂薄膜与杨木单板的界面相容性。 相似文献
19.
采用不同链长的聚醚多元醇与多亚甲基多苯基多异氰酸酯（PAPI）反应,制备了两种不同结构的水性异氰酸酯（P-C、P-D）,联剂分别加入到氧化玉米淀粉胶黏剂和脲醛树脂胶黏剂中,以改善胶黏剂的胶接性能。通过粘接强度测试研究不同结构、不同用量的水性异氰酸酯对改性胶黏剂的胶接强度和耐水性的影响。实验结果表明：氧化玉米淀粉和脲醛树脂中加入水性异氰酸酯交联剂制备胶合板,胶接强度及耐水性均有显著提高。氧化玉米淀粉胶黏剂中加入10%的水性异氰酸酯P-D后,所制备胶合板的干态剪切强度可达2.64MPa。脲醛树脂胶黏剂中加入7.5%的P-D后,干态、湿态剪切强度分别为1.24MPa和1.23MPa,甲醛释放量为0.31mg/L,达到E0级标准。 相似文献