共查询到18条相似文献，搜索用时 171 毫秒
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利用ESCA对苯基异氰酸酯与不同含水率纤维素反应的研究 总被引：2，自引：2，他引：0
通过ESCA分析研究 ,确定纤维素的C1S电子结合能在 2 85 95eV左右只有一个对称单峰 ;苯基异氰酸酯与水反应产物N ,N -二苯基取代脲的C1S电子结合能有 2个峰值 ,分别是 :羰基 (2 88 6± 0 1)eV ,苯环峰 (2 84 7±0 1)eV ;随着纤维素含水率的增加 ,苯基异氰酸酯与水反应的比例越来越多 ,当含水率为 9 78%的纤维素与苯基异氰酸酯反应时 ,与水反应的异氰酸酯基占总消耗异氰酸酯基的 92 98%。通过刻蚀技术研究发现 ,苯基异氰酸酯反应产物主要分布于纤维素的表面。 相似文献
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用差式扫描量热法(DSC)对苯基异氰酸酯与木素、纤维素、木粉的反应进行探究.在不同升温速率下,试验对比苯基异氰酸酯分别与木素、木粉在绝干含水率和平衡含水率(木素为3%,木粉为5%)条件下的反应特征;同时研究木素存在下苯基异氰酸酯与纤维素的反应特性.基于对DSC图的讨论分析和Ozawa方程,求解苯基异氰酸酯分别与木素、木粉反应的活化能,初步揭示异氰酸酯分别与木素、纤维素、木材的胶接反应特性.研究表明:苯基异氰酸酯与木素反应温度和活化能相对于苯基异氰酸酯与木粉反应的温度和活化能要低;木素与纤维素混合时,异氰酸酯主要与木素反应,当纤维素的含量较大时,纤维素与异氰酸酯反应程度加大;当木材含水率为5%时,水分导致含水木材与异氰酸酯反应活化能降低了34%. 相似文献
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对湿固化异氰酸酯胶黏剂粘接高含水率桦木的胶接机理进行系统研究。利用计算化学方法这一崭新的手段,采用Material Studio软件中DMol3模块,采用基于密度泛函理论的量子化学程序,通过模拟胶接体系中异氰酸酯基团(NCO)与自由水(H2O)及桦木中不同化学环境羟基(—OH)的反应历程,搜索反应的过渡态,计算反应活化能以及反应总能量,判定反应进行的难易以及先后次序。研究结果表明胶接体系中—NCO基团与自由水反应的活化能与—NCO基团与纤维素中—OH的反应活化能相接近,反应存在竞争关系。胶接体系中—NCO与纤维素上—OH相对来说较容易反应,且反应进行的顺序是C6C3C1C2,均为放热反应;与木质素上—OH不容易反应,反应进行的顺序是紫丁香基丙烷(Lig-S)愈创木基丙烷(Lig-G)对羟苯基丙烷(Lig-H),其中羟基与Lig-S和Lig-G的反应是放热反应,与Lig-H的反应是吸热反应。 相似文献
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通过微晶纤维素的氰乙基化试验,研究了反应温度和反应时间对氰乙基化产物取代度(DS)的影响,表明在50℃以下,微晶纤维素的氰乙基化取代度随反应温度的升高和反应时间的延长而增加。傅里叶红外光谱分析显示微晶纤维素氰乙基化后羟基峰明显减弱,并形成了新的碳氮三键吸收峰,证明纤维素中的部分羟基氢被氰乙基所取代。X射线衍射分析显示微晶纤维素中原有的结晶结构被破坏。X4显微熔融温度测定仪、维卡软化点测定仪等的分析表明微晶纤维素氰乙基化产物的热塑性先随取代度的升高而提高,取代度超过1.43后,产物的热塑性又随取代度的升高而下降。确定了微晶纤维素氰乙基化在不同温度(30、35、40和45℃)下的反应速率常数(分别为1.30、1.61、1.94和2.26 s-1),计算出了微晶纤维素氰乙基化反应的表观活化能为29.8 kJ/mol。 相似文献
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《林产化学与工业》2017,(4)
利用离子液体1-丁基-3-甲基咪唑氯盐([Bmim]Cl)/乙醇为混合溶剂,对毛竹纤维的溶解特性进行了研究。研究发现:在[Bmim]Cl与乙醇体积比为5∶12,去离子水质量分数为4%,于160℃反应12 h,毛竹纤维溶解率达到18.14%,再生的纤维素产物得率约为81.84%;同时利用热重(TG-DTG)、X射线衍射(XRD)和傅里叶红外光谱(FT-IR)等测试手段发现,离子液体热稳定性良好,在本研究160℃时不会分解;XRD结果显示预处理后再生的纤维素产物结晶度提高,从原料毛竹纤维的26.54%增加到31.21%,且均具有典型的纤维素I型特征;FT-IR表明溶解的纤维素结构没有显著改变。 相似文献
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GAO Zhenhua GU Jiyou LI ZhiguoCollege of Material Science Engineering Northeast Forestry Univ. Harbin P.R. China 《中国林业科技(英文版)》2004,3(2):41-48
The practical occasions for isocyanate bonding to woodare often that of heat, high moisture or rich water.When isocyanate reacted with functional groups inwood, such as hydroxyl groups, it formed thecarbamate that fulfils isocyanates powerful chemicalbonding. Meanwhile, it reacted with water or its vapourand formed polyurea, which is a completing reactionwith that of forming carbamate(Rowell, et al., 1981).As a result, this completing reaction correlates to thefinal bonding performance of iso… 相似文献
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采用不同链长的聚醚多元醇与多亚甲基多苯基多异氰酸酯（PAPI）反应,制备了两种不同结构的水性异氰酸酯（P-C、P-D）,联剂分别加入到氧化玉米淀粉胶黏剂和脲醛树脂胶黏剂中,以改善胶黏剂的胶接性能。通过粘接强度测试研究不同结构、不同用量的水性异氰酸酯对改性胶黏剂的胶接强度和耐水性的影响。实验结果表明：氧化玉米淀粉和脲醛树脂中加入水性异氰酸酯交联剂制备胶合板,胶接强度及耐水性均有显著提高。氧化玉米淀粉胶黏剂中加入10%的水性异氰酸酯P-D后,所制备胶合板的干态剪切强度可达2.64MPa。脲醛树脂胶黏剂中加入7.5%的P-D后,干态、湿态剪切强度分别为1.24MPa和1.23MPa,甲醛释放量为0.31mg/L,达到E0级标准。 相似文献
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异氰酸酯树脂胶粘剂刨花板制板工艺研究 总被引：13，自引：0，他引：13
研究了用异氰酸酯树脂胶粘剂制造刨花板的工艺条件,详细讨论了热压温度、热压时间、密度含水率、施胶量和施蜡量和对刨花板为物理力学性能的影响。结果表明：刨花含水率是继热压工艺三个因素之后的重要影响因子。研究中还发现了“厚度膨胀率平行性”现象,对其进行的深入分析研究揭示了不可逆厚度膨胀率为２４ｈ吸水厚度膨胀率的关系,总结出板材２４ｈ吸水厚度膨胀率的改善只能通过改善不可逆度膨胀率获得。研究结果还表明,利用Ｙ 相似文献
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The durability of isocyanate resins consisting of emulsion-type polymeric diphenylmethane diisocyanate (EMDI) was investigated under constant steam heating. Two kinds of resin, water only-added resin and polyol/water-added resin, were used in this study. The degradation of the resins under steam heating was observed using Fourier transform infrared spectroscopy (FT-IR), weight changes, and thermogravimetric analysis (TGA). FT-IR analysis showed that the degradation reaction of the resins scarcely proceeded for a few hours and then increased significantly. The weights of the resins decreased linearly during steam heating. The thermal stability of steam-treated resins was made clear by TGA. The bond strength reductions of the specimens bonded with the resins were also observed. The best fitting regression function for the behavior of bond strength reduction was determined statistically. The apparent activation energy of each resin was calculated from the regression function, for the half-life period. Considering the calculated values, the adhesion durability of using polyol-added resin was superior to that of using water only-added resin. It was clarified that the durability of the isocyanate resins under steam heating was markedly inferior to that under dry heating.Part of this paper was presented at the 50th Annual Meeting of the Japan Wood Research Society, Kyoto, 2000 相似文献
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The thermo-oxidative degradation of various polyol-added isocyanate resins for wood adhesives was studied using differential scanning calorimetry and thermogravimetry. The degradation of the resin cured with water began at 150°C. When a certain polyol was added to the resin at an NCO/OH ratio of 25 in addition to water, the cured resin began to degrade at 200°C. To clarify the cause of the good thermal stability in polyol-added resins, the effect of various polyols on the reactivity of isocyanate was investigated. It was found that the reactivity of isocyanate was enhanced by the addition of a dipropylene glycol and glycerin-type polyols. In addition, the effect of the NCO/ polyol-OH ratio was investigated using dipropylene glycoltype polyol. The reactivity of isocyanate increased with increasing polyol content. The thermal stability of the resin was improved to a certain degree by addition of a small amount of the polyol but deteriorated when a large amount of the polyol was added.Part of this paper was presented at the 48th annual meeting of the Japan Wood Research Society, Shizuoka, April 1998 相似文献
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To study the effect of postcure conditions on the viscoelastic behavior of water-based polymer isocyanate adhesives for wood
(API adhesive), dynamic mechanical analysis (DMA) was performed for a simplified model of API adhesives under various postcure
conditions. These conditions were achieved by storing the samples at room temperature or by heating them in an oven. Fourier
transform infrared (FT-IR) spectroscopy was performed to test for residual isocyanate groups (NCO) and isocyanate derivatives
to elucidate the reaction mechanism under the postcure conditions. DMA revealed that the postcure conditions led to wide variations
in the viscoelastic behaviors of API films. FT-IR analysis confirmed the decrease of residual isocyanate during postcure treatments.
However, the complete consumption of isocyanate could not be achieved under the postcure conditions. A good correlation was
found between the DMA result and the chemical changes in the API samples heated above 140°C. However, no correlation was observed
in the case of the samples heated at temperatures less than 140°C. This implies that postcure conditions led to a difference
in the reaction chemistry of API.
Part of this article was presented at the 55th Annual Meeting of the Japan Wood Research Society, Kyoto, March 2005 相似文献