| 硅片边缘超声振动辅助化学机械抛光实验 |
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| 引用本文： | 刘仁鑫,杨卫平,吴勇波.硅片边缘超声振动辅助化学机械抛光实验[J].农业机械学报,2010,41(2):221-226. |
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| 作者姓名： | 刘仁鑫 杨卫平 吴勇波 |
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| 作者单位： | 1. 江西农业大学工学院,南昌,330045
2. 日本秋田县立大学机械智能系统工程系,秋田,015-0055 |
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| 基金项目： | 日本秋田县新规事业开发支援基金资助项目 |
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| 摘 要： | 提出一种超声振动辅助化学机械复合抛光硅片边缘新技术,建立了抛光工具设计、性能检测及复合抛光实验系统,并进行了不同超声振动形式传统化学机械以及抛光工具对硅片边缘抛光的实验研究.结果表明,在相同抛光条件下,抛光工具超声椭圆振动对抛光效果的改善作用最佳.抛光工具加入超声椭圆运动后,工件表面粗糙度值Ra由传统抛光法的0.059 μm降低到0.043 μm,材料去除量增加22%,且抛光表面形貌有明显改善.
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| 关 键 词： | 硅片边缘 超声椭圆振动 复合抛光 |
Experiment on Silicon Wafer Edge Hybrid Polishing of Ultrasonic Vibration and Chemical Mechanical |
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| Liu Renxin,Yang Weiping and Wu Yongbo.Experiment on Silicon Wafer Edge Hybrid Polishing of Ultrasonic Vibration and Chemical Mechanical[J].Transactions of the Chinese Society of Agricultural Machinery,2010,41(2):221-226. |
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| Authors: | Liu Renxin Yang Weiping and Wu Yongbo |
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| Institution: | 1.College of Engineering/a>;Jiangxi Agricultural University/a>;Nanchang 330045/a>;China2.Department of Machine Intelligence and Systems Engineering/a>;Akita Prefectural University/a>;Akita 015-0055/a>;Japan |
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| Abstract: | A newly hybrid technique for silicon wafer edge polishing of ultrasonic-vibration and chemical mechanical was presented,and the design,performance testing for the polishing tools,were discussed along with establishment of experimental system for the hybrid polishing.And then,the traditional chemical mechanical polishing,as well as the polishing tool with different forms of ultrasonic-vibration was investigated on polish for the edge of silicon wafer.Experimental results showed that in the same polishing con... |
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| Keywords: | Silicon wafer edge Ultrasonic-elliptic-vibration Hybrid polishing |
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