Water resistance properties of kenaf core binderless boards |
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| Authors: | Nobuhisa Okuda Masatoshi Sato |
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| Institution: | (1) Department of Global Agricultural Sciences, Graduate School of Agricultural and life Sciences, The University of Tokyo, 1-1-1 Yayoi, Bunkyo-ku, Tokyo 113-8657, Japan |
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| Abstract: | Abstract Binderless boards were prepared from kenaf core under various manufacturing conditions and their water resistance
properties were evaluated. The board properties evaluated were retention ratios of modulus of rupture (MOR) and modulus of
elasticity (MOE), internal bonding strength after water treatment (IB), thickness swelling (TS), water absorption (WA), and
linear expansion (LE). These values were then compared with those of boards bonded with urea-formaldehyde (UF), urea melamine
formaldehyde (UMF), and phenol-formaldehyde (PF) resins, and their water resistance properties were assessed. We found that
pressing temperature was one of the most important conditions for the improvement of water resistance properties. The retention
ratios of MOR, MOE, and IB of kenaf core chip binderless boards (pressing temperature 200°C, target density 0.8g/cm3, and the three-step pressing of 6MPa for 10min, then 4MPa for 3min, and 2MPa for 3min) were 37.1%, 49.9%, and 55.7%, respectively,
compared with values for UMF-bonded boards of 22.5%, 27.1%, and 40.7%, and values for PF-bonded boards of 42.8%, 41.8%, and
54.1%, respectively. The results showed that the water resistance properties of binderless boards were higher than those of
UMF-bonded boards and almost as high as those of PF-bonded boards.
Part of this article was presented at the 53rd Annual Meeting of the Japan Wood Research Society, Fukuoka, March 2003 |
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| Keywords: | Self-bonding Binderless board Water resistance property Kenaf core |
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