Development of binderless fiberboard from kenaf core |
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| Authors: | Jianying Xu Ragil Widyorini Hidefumi Yamauchi Shuichi Kawai |
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| Institution: | (1) Research Institute for Sustainable Humanosphere, Kyoto University, Gokasho, Uji, Kyoto 611-0011, Japan;(2) Institute of Wood Technology, Akita Prefectural University, Kaieisaka, Noshiro 016-0876, Japan;(3) College of Industry, Central South Forestry University, Changsha, Hunan, 410004, China |
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| Abstract: | Binderless fiberboards with densities of 0.3 and 0.5 g/cm3 were developed from kenaf core material using the conventional dry-manufacturing process. The effects of steam pressure (0.4–0.8
MPa) and cooking time (10–30 min) in the refining process, fiber moisture content (MC) (10%, 30%), and hot-pressing time (3–10
min) on the board properties were investigated. The results showed that kenaf core binderless fiberboards manufactured with
high steam pressure and long cooking time during the refining process had high internal bond (IB) strength, low thickness
swelling (TS), but low bending strength values. The binderless fiberboards made from 30% MC fibers showed better mechanical
and dimensional properties than those from air-dried fibers. Hot-pressing time was found to have little effect on the IB value
of the binderless board at the refining conditions of 0.8 MPa/20 min, but longer pressing time resulted in lower TS. At a
density of 0.5 g/cm3, binderless fiberboard with the refining conditions of 0.8 MPa/20 min recorded a modulus of rupture (MOR) of 12 MPa, modulus
of elasticity (MOE) of 1.7 GPa, IB of 0.43 MPa, and 12% TS under the optimum board manufacturing conditions.
Part of this article was presented at the 54th Annual Meeting of the Japan Wood Research Society, Hokkaido, August 3–5, 2004 |
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| Keywords: | Binderless fiberboard Kenaf core Processing variables Chemical composition |
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