| 刨花板常规热压传热研究 |
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| 引用本文： | 谢力生,牛义.刨花板常规热压传热研究[J].中南林业科技大学学报,2005,25(5):63-67. |
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| 作者姓名： | 谢力生 牛义 |
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| 作者单位： | 中南林学院工业学院，中南林学院工业学院 湖南 长沙 410004，湖南 长沙 410004 |
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| 基金项目： | 湖南省教育厅科研项目，中南林学院校科研和教改项目 |
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| 摘 要： | 采用常规热压法对刨花板板坯进行热压,探讨热压时中心层温度变化规律与板坯含水率、板厚、板材密度及热压温度等的关系.结果表明:在快速升温段,升温速度随板厚的增加而明显减小,随热压温度的提高而加快;在慢速升温段,升温速度随板厚的增大而显著加快,随热压温度的升高而明显加速,升温速度受目标密度和板坯含水率影响很小;板坯内水分蒸发所需时间随板厚、板坯含水率、热压温度、板材密度的增长而增加;板坯内水分蒸发温度随板材密度的增加而升高,随板厚的减少而升高,热压温度和板坯含水率对其几乎没有影响;加入胶粘剂会使快速升温段的升温速度有所加快,而使恒温段的水分蒸发温度有所降低.
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| 关 键 词： | 刨花板 热压 传热 热压温度 板厚 板坯含水率 |
| 文章编号： | 1000-2502(2005)05-0063-05 |
| 修稿时间： | 2005年1月25日 |
Heat-conduction of Particleboard by Conventional Hot-pressing Methods |
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| XIE Li-sheng,NIU Yi.Heat-conduction of Particleboard by Conventional Hot-pressing Methods[J].Journal of Central South Forestry University,2005,25(5):63-67. |
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| Authors: | XIE Li-sheng NIU Yi |
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| Abstract: | By means of conventional hot-pressing, the mat of particleboard was made to study the relations between the changing regularity of mat central layer temperature and the moisture content of mat. thickness and density of panels, hot-pressing temperature, etc. The results show that in the fast-raising phase of temperature, the growth speed of temperature evidently decelerates as the panel thickness gets thicker and raises with the increase of hot pressing temperature; that during the slowing-raising phase of temperature, the growth speed of temperature evidently goes up as the panel thickness gets thicker and as the hot-pressing temperature climbs, the growth speed of temperature is hardly affected by the target density and moisture content of mat; that the water vaporizing time increases with the increase of panel thickness, moisture content of mat and hot-pressing temperature panel density; that the water vaporizing temperature within the mats increases as the panel density is higher and as the panel thickness reduces, it is hardly afffected by the hot-pressing temperature and moisture content of mat; and that using adhesive in the partieleboard, the temperature accelerates to a certain extent in the growth speed phase of temperature and the temperature of water vapouizing lowers down to some extent in the constant temperature phase. |
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| Keywords: | particleboard hot-pressing thermal conduction hot-pressing temperature panel thickness moisture content of mat |
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